Thermal Components - 汎海科技 therlect

Thermal Components

Vapor Chamber (VC)

Heat Pipe (HP)

Ultra Thin Cooling Plate (UTCP)

SUS UTCP

Glass UTCP

3D Vapor Chamber (3D VC)

Thermal Ceramic Heatsink

Thermal Insulation Pad

Thermal Conductive Pase Change Material

Thermal Insulation Grease

Thermal Double Tape

Two Part Thermal Conductive Filter

Thermal Liguid Metal Paste

Thermal Liguid Metal Pad

Thermal Insulation Gel

Glass UTCP 玻璃散熱模組

Material : Glass (Thickness 0.5~1mm)

The glass material which uses UTCP technology, can be used above TX / RX coil heat dissipation, solve the shielding effect caused by metal materials used for heat dissipation above the coil.

UTCP technology can be improve material with low thermal conductivity (K).

玻璃材質應用於射頻晶片&無線充電線圈上方的散熱，可避免金屬屏蔽效應。

Pure Glass

UTCP Glass

Thickness

1.2mm

Input Power (3W)

176 ℃

75 ℃

Thermal Conductivity

0.8

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